Packaging Engineer- Flip Chip at Volantis

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip).

This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability, failure analysis, and cross-functional support through package and system productization.

Core Responsibilities:

• Develop and optimize flip chip attach processes including bump formation,

placement, reflow, and underfill for high-performance semiconductor packages.

• Define and manage bump metallurgy stacks (e.g., Cu pillar, SnAg, micro-bumps)

and substrate pad finishes for robust interconnect performance.

• Drive package integration from die to substrate, ensuring alignment, coplanarity,

and yield optimization.

• Evaluate and mitigate assembly risks including warpage, non-wet opens, voiding,

head-in-pillow, and interconnect defects.

• Collaborate with substrate vendors, OSATs, and internal teams to define design

rules (pad pitch, bump pitch, keep-outs, stack-ups).

• Lead process development for reflow profiles, flux selection, cleaning, and underfill

dispense/cure.

• Perform root cause analysis of assembly and reliability failures using cross-

sectioning, SEM, CSAM, and other failure analysis techniques.

• Support reliability qualification including thermal cycling, drop, mechanical shock,

and power cycling.

• Work cross-functionally with design, reliability, thermal, and manufacturing teams

to ensure robust package performance from concept through high-volume

production.

Required Technical Skills:

• Strong experience in flip chip packaging and assembly processes for

semiconductor devices.

• Deep understanding of bumping technologies (solder bumps, Cu pillar, micro-

bumps) and UBM/metallization systems.

• Experience with underfill materials, dispense techniques, flow behavior, and cure

processes.

• Understanding of thermo-mechanical behavior in flip chip assemblies (CTE

mismatch, warpage, solder fatigue, reliability risks).

• Hands-on experience with failure analysis and reliability testing (cross-sections,

SEM, CSAM, thermal cycling).

• Ability to work with OSATs and suppliers to develop and transfer assembly

processes into production.

• Strong problem-solving skills with ability to debug yield and reliability issues in

manufacturing environments.

Preferred / Differentiating Skills:

• Experience with III-V packaging, photonics packaging, and precision chip attach.
• Experience with advanced packaging technologies including 2.5D interposers, 3D

stacking, chiplets, and CoWoS-like architectures.

• Familiarity with bill of materials used in photonics packaging such as clear

adhesives and underfills as well as mold compounds and underfills for 2.5D

advanced packaging.

• Familiarity with fine-pitch micro-bump and hybrid bonding approaches.
• Experience integrating high-power or high-TDP devices with tight warpage and

thermal constraints.

• Exposure to thermo-mechanical modeling or collaboration with simulation teams

for warpage and reliability prediction.

• Understanding of system-level interactions (PCB attach, second-level interconnect

reliability).