Posted on:July 25, 2026
Photonics Packaging Engineer at Volantis
Volantis is hiring a Photonics Packaging Engineer in San Francisco, CA, US +2 more. Remote.
About Volantis
Volantis builds photonic interconnect and memory infrastructure for AI inference, targeting very large models with over 10 trillion parameters. Its technology uses optical waveguides to provide high-bandwidth, rack-scale memory pools, aiming to run large AI models at low latency.
Photonics Packaging Engineer job description
What We're Looking For:
We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages.
This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.
Ideal Background:
- Experience with integrated photonics package assemblies with multiple dies
- Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
- Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Nice to Have:
- Experience with large device count photonic assemblies
- Experience with clear underfill
- Experience with high density fiber attach
- Experience with large substrate size photonic MCM assemblies
- Hands-on experience with PIC design
Apply now
Applications go straight to Volantis. We never sit between you and the employer.
Apply now ↗
