Engineering Jobs at Lidrotec

Lidrotec provides laser dicing technology for cutting microchips and devices (wafer dicing). The process uses a laser combined with controlled fluids to cool the workpiece, rinse away particles, and improve laser ablation. The technology targets industries such as semiconductor, energy, medicine, electronics, and material science.

Lidrotec is also hiring in operations (1).

Its roles are in Bochum, Germany (1).

You own whole parts of the product rather than one service inside a large system. Expect to write the code, deploy it, and get paged when it breaks. Reviews are quick and the codebase is small, so a decision made on Tuesday can ship on Thursday.